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COM Express® Tipo 6

Factor de forma COM Express Basic (125 x 95 mm), factor de forma Compact (95 x 95 mm) y distribución de pines tipo 6.

Intel®New Gen Core™ ultra; 2x DDR5 SO-DIMM to 128GB IBECC; 20 PCIe Gen4 lanes; 4x USB 3.2 Gen2; 3x DDI, eDP/LVDS
COM Express Type 6 Compact Size Module with AMD Ryzen™ Embedded 8000 Processor, DDR5 SO-DIMM, DDI, eDP, LVDS, VGA, PCIe Gen 4, USB 3.2 Gen2, discrete TPM 2.0, SATA, Out-of-Band (OOB) Management
Intel®PTL-H; 4P+8E+4LPE; 12Xe GPU (120 TOPS), NPU 5 (50 TOPS); 2x DDR5 SO-DIMM to 128GB IBECC; 12 PCIe Gen4 lanes; USB3.2, SATA, DDI, eDP/LVDS; MIPI-CSI
COM Express Type 6 Basic size module with Intel®New Gen Core Ultra 200 Series Processor DDR5 SO-DIMM, DDI, PCIe Gen 4,USB 3.2 Gen2, 2.5 Gigabit TSN Ethernet, discrete TPM 2.0, eDP, SATA
COM Express® Type6 Compact size module with Intel Atom® x7000E/RE Series SoC DDR5 SO-DIMM, DDI, PCIe Gen 3, USB 3.2 Gen2, 2.5 Gigabit TSN Ethernet, discrete TPM 2.0, eDP, SATA
COM Express Type6 Compact size module with Intel®13th Gen P/U Processor DDR5 SO-DIMM, DDI, PCIe Gen 4, USB4, USB 3.2 Gen2, 2.5 Gigabit TSN Ethernet, discrete TPM 2.0, eDP, SATA
COM Express Type6 Basic size module with Intel®13th Gen H Processor DDR5 SO-DIMM, DDI, PCIe Gen 4, USB 3.2 Gen2, 2.5Gb Ethernet, discrete TPM 2.0, eDP, SATA
Intel®Tiger Lake-UP3 Core™ Processor based on Type VI COM Express module with dual DDR4 SO-DIMM, DDI, eDP, Gigabit Ethernet, SATA 3.0, and USB 3.2
COM Express Type-VI Basic module with Intel®11th Gen H Processor with DDR4 SO-DIMM, DDI, PCIe Gen 4.0, USB 3.2 Gen2x1, 2.5 Gigabit TSN Ethernet, discrete TPM 2.0, eDP/LVDS, SATA III and VGA
Intel Atom® Elkhart Lake series SoC based on Type 6 Compact COM-Express® module with 2x DDR4 SD-DIMM Socket
Intel®Comet Lake-S Core™ Processor based on Type VI COM Express module with dual DDR4 SO-DIMM, DDI, LVDS, VGA, Gigabit Ethernet, SATA III, and USB 3.2 Gen2
Intel®Coffee Lake-S Core™ Processor based on Type VI COM Express module with dual DDR4 SO-DIMM, DDI, LVDS, Gigabit Ethernet, SATA III, and USB 3.2 Gen2
Intel®7th Generaon Core™ Kaby Lake-S processors based on Type VI Compact-COM Express 2.0 module with DDR4 SDRAM on Two SO-DIMM slots, VGA, eDP, DP, Gigabit Ethernet, PCIE, SATA and USB
Intel®Core™ 7th Generaon Processor based on Type VI COM Express module with DDR4 SDRAM, VGA, LVDS, Gigabit Ethernet, SATA 3.0 and USB
Intel Atom® Apollo Lake series SoC based on Type 6 Compact COM-Express® module with 2x DDR3L SD-DIMM Socket
Intel®Core™ Kaby Lake-U/Skylake-U i7/i5/i3 series processor based on Type 6 Compact COM-Express® module with 2x DDR4 SD-DIMM Socket
Intel Atom®TM N3000 series based TypeVI COM Express with DDR3L SDRAM, VGA, LVDS, USB 3.0, PCIE and surround design.Intel Atom®TM N3000 series based TypeVI COM Express with DDR3L SDRAM, VGA, LVDS, USB 3.0, PCIE and surround design.
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Intel®Core™ Whiskey Lake-U i7/i5/i3 series processor based on Type 6 Compact COM-Express® module with 2x DDR4 SD-DIMM Socket